Modern Plastics Middle East

USIBC Signs MOU with Government of Telangana, Hosts AI and GCC Industry Roundtable

9,567

USIBC Signs MOU with Government of Telangana, Hosts AI and GCC Industry Roundtable

The U.S. Chamber of Commerce’ s U.S. India Business Council Global Private Limited (USIBC GPL) and the Department of Information Technology, Electronics & Communications (IT E&C), Government of Telangana, signed a Memorandum of Understanding (MOU) to bolster U.S.-India collaboration and partnership in technological innovation.

The MOU was signed in the presence of Chief Guest, Honourable Minister for Information Technology (IT), Electronics & Communications (E&C), Industries & Commerce (I&C), and Legislative Affairs, Shri D Sridhar Babu and Special Chief Secretary to the Government of Telangana for IT E&C and I&C, Shrit Jayesh Ranjan, Guest of Honour, Ms. Jennifer Larson, U.S. Consul General Hyderabad, and USIBC Managing Director Rahul Sharma.

The MoU outlines cooperation in key focus sectors including IT, Artificial Intelligence (AI), electronics and Global Capability Centers (GCCs). The signing was followed by an industry roundtable on AI and GCCs, reinforcing Hyderabad and Telangana’s role as a global technology hub.

Honourable Minister Shri D. Sridhar Babu noted, “Telangana has emerged as a global leader in innovation, and this MoU marks a new chapter in deepening our partnership with the United States. Our collaboration with USIBC is focused on driving investment, fostering innovation, and generating employment opportunities, paving the way for a future powered by cutting-edge technologies such as AI and GCCs.”

Guest of Honour Ms. Jennifer Larson remarked, “The United States and India share a vision of leveraging technology to solve global challenges. This MoU is a testament to the strong collaboration between Telangana and U.S. businesses, showcasing how regional partnerships can drive innovation, economic growth, and mutual prosperity.”

Special Chief Secretary to the Government of Telangana for IT E&C and I&C, Shri Jayesh Ranjan said, “Hyderabad’s thriving technology ecosystem, supported by a robust talent pool and progressive policies, is a testament to the state’s commitment to innovation. This partnership with USIBC will further position Telangana as a leading destination for global investments in emerging technologies.”

The discussion highlighted Hyderabad’s thriving ecosystem of skilled professionals and its pivotal role in U.S.-India collaborations. The participants explored AI-driven opportunities across sectors as well as the ways to optimally harness AI technological innovation for global good while at the same time prevent misuse via regulation, governance, ethical use, in a manner that does not stifle innovation.

Rahul Sharma, Managing Director of USIBC, stated, “This MoU represents a pivotal moment in strengthening the technological and economic ties between the United States and Telangana. By leveraging the state’s dynamic ecosystem and the expertise of U.S. industry, we are unlocking new opportunities in AI and GCCs that will define the next phase of global innovation. USIBC is proud to support this partnership, which underscores our dedication to advancing transformative initiatives and creating pathways for sustainable growth and shared success.”

USIBC is thrilled to deepen technological ties between U.S. and Indian regional governments and pursue activities with industry under U.S.– India initiative on critical and emerging technologies (iCET). Launched at the U.S. Chamber of Commerce in January 2023, USIBC has worked closely with governments and industry in pursuing activities across iCET sectors including AI, semiconductors and electronics, advanced telecommunications, space tech, among other areas.

https://www.uschamber.com

#uschamber#modernplasticsindia #modernplasticsasia #modernplastics#plasticsnews#plasticsplanet

#modernrecyclingindia#modernplasticsglobal#modernplasticsworld#plasticstalk

#modernplasticsgermany#modernplasticsnetwork #plasticdevelopment